Technical Challenges and Possible Solutions for Development of CMOS-MEMS and Piezoelectric MEMS Accelerometers
Tuesday | March 26, 2024 | 14:10 - 14:40
A technical presentation on the development of CMOS-MEMS and piezoelectric MEMS accelerometers, including design, modeling, simulation, fabrication, and testing, will be delivered. A special focus lies on the challenges we encountered during the development phase, such as in (i) device level: design trade-off, thin-film residual stress, fabrication imperfection/variation, etc.; (ii) interfaced circuit level: biasing issue, dc drift on high impedance node, low-corner frequency and bandwidth, etc.; (iii) sensing module level: packaging issues, spurious resonance from PCB/packaging, non-uniform frequency response, calibration, etc. Some potential approaches will be elaborated to address the aforementioned technical challenges. Finally, I will briefly introduce the applications of our developed MEMS vibration sensing module (accelerometer) in it’s a-site and b-site verifications.